Equipment＆Charges (2021.4.1～)

■Microstructural Characterization
■Nanofabrication(MEMS) 　　

Microstructural Characterization (Institute for Materials Research/The Electron Microscopy Center)
■Technical support charge: 3,300 yen/hour
■Sample preparation room：330yen/hour
Equipment usage Charges【yen/day(8hours)】
Equipment name
Open Project
Classified Project
SU8000,S-5500
 14,080 72,160
Titan80-300
36,080 106,480
FEI-Titan G2-cubed
 46,640 121,440
FEI-Titan G2-cubed
 50,160 125,860
※All charges listed here are including tax.
Microstructural Characterization (Analytical Research Core for Advanced Materials)
■Technical support charge:
Open project:3,300 yen/hour
Classified Project:6,600yen/hour
Equipment usage Charges【yen/day(8hours)】
Equipment name
Open Project
Classified Project
JEM-ARM200F
30,800 163,680
Topcon EM-002B 25,520 51,920
JEOL JEM-2000EXⅡ 16,720 34,320
FIB-SEM(Quanta 3D)
 30,360 62,920
FIB-SEM(Versa 3D)
 30,360 62,920
JEOL EM-09100IS 17,600 32,560
PIPSⅡ 9,680 22,880
Model1010 3,520 13,200
X-ray Diffractometer
 6,160 32,560
Thermoanalysis
 5,280 12,320
All charges listed here are including tax.
Microstructural Characterization ( Research and Analytical Center for Giant Molecules)
Equipment usage Charges【yen/day(8hours)】
Equipment name
Open Project
Classified Project
Nuclear magnetic resonance (NMR)
 5,200 32,100
ICP optical emission spectrometer
 3,200 4,600
・Raw chemicals for syntheses are not included.
・All charges listed here are including tax.
Nanofabrication(MEMS)
【Open Project】
■Technical support fee: 3,300 yen/hour　　
■Facility usage charge: 960 yen/hour（790 yen/hour for the use within the Universityr ）

【Classified Project】
■Technical support fee: 6,514 yen/hour　　
■Facility usage charge: 960 yen/hour（790 yen/hour for the use within the Universityr ）

Price List(PDF)
No.
Equipment name
Open P
Charges
yen/hour
Charges
(yen/hour)
No.
Equipment name
Classified P
Charges
yen/hour
Charges
(yen/hour)

A.Cleaning & drying
A-1
Draft chamber
 1,290 1,548
A-7
Spin-drying machine
 2,428 2,914
A-2
Draft chamber for SiN etching
 1,730 2,076
A-8
Organic draft chamber
 1,290 1,548
A-4
Inert oven for sintering
 1,710 2,052
A-9
4" spin drying machine
 2,612 3,134
A-5
Vacuum oven
 994 1,192
A-10
6"spin drying machine
 2,612 3,134
A-6
Brush scrubber
 6,906 8,286        

B.Photolithography
B-2
Spin coater
 2,170 2,604
B-13
Elionix EB lithography
 9,422 11,306
B-3
Clean oven
 2,830 3,396
B-14
Laser writer
 7,094 8,512
B-4
Curing oven
 1,872 2,246
B-15
Maskless exposure system for ball
 4,450 5,340
B-5
Double-side aligner
 3,240 3,888
B-16
Spin dryer
 2,208 2,650
B-8
Draft chamber for development
 1,290 1,548
B-17
Hot plate
 994 1,192
B-9
UV curing
 4,120 4,944 B-18 maskless aligner 5,374 6,450
B-10
Spin coater
 2,332 2,798 B-19 i-line stepper 14,960 29,700
B-11
Spray developer
 2,156 2,588 B-20 Coater developer 6,458 13,200

C.Oxidation/diffusion, ion injection and heat treatment
C-1
Oxidation furnace (for semiconductors)）
10,598 12,716
C-7
Annealing furnace
 10,112 12,134
C-2
Oxidation furnace (for MEMS)
 9,168 11,000
C-8
Medium-current ion injector
 19,934 23,922
C-3
P diffusion furnace
 11,562 13,874
C-10
Rapid thermal annealing
 8,522 10,226
C-4
P push-in furnace
 9,854 11,824 C-11
Metal diffusion furnace
 7,856 9,426
C-5
B diffusion furnace
 10,938 13,126        
C-6
B push-in furnace
 9,854 11,824        

D.Deposition
D-1
LPCVD（SiN）
12,108 14,530
D-12
MOCVD
 19,484 23,382
D-2
LPCVD（Poly-Si）
 11,838 14,206
D-13
JPEL PECVD
 15,156 18,188
D-3
LPCVD（SiO2）
12,808 15,368 D-14
TEOS PECVD
 16,904 20,286
D-4
CVD
21,326 25,590 D-15
Automatic Shibaura
sputtering
 6,524 7,828
D-5
SUMITOMOSEIMITU PECVD
15,350 18,420
D-16
Sputtering for ball
 4,392 5,270
D-6
W-CVD
9,818 11,782 D-17
ALD
 10,418 12,502
D-7
ANELVA sputtering equipment
 8,588 10,306
D-18
High-temp. sputtering and O2 annealing
 11,698 14,038
D-8
SHIBAURA sputtering equipment
 3,758 4,510
D-20
 ECR long-throw sputter 6,450 7,740
D-9
Electron beam evaporator
 6,838 8,206
D-21
 SPP Technologies TEOS PECVD 16,770 21,507
D-10
Sol-gel auto-deposition system
 8,066 9,680        
D-11
Plating equipment
 2,534 3,040
     

E.Etching
E-1
DeepRIE #1
 8,054 9,666
E-12
TMAH etching equipment
 3,112 3,734
E-2
DeepRIE #2
8,054 9,666
E-13
DeepRIE #4
 14,770 17,724
E-3
DeepRIE #3
8,278 9,934
E-14
Ion milling
 11,360 13,632
E-4
ANELVA RIE equipment
7,078 8,494
E-15
Vapor HF etching
 8,534 10,240
E-5
ANELVA Si RIE equipment
 6,346 7,616
E-16
Ulvac ICP-RIE#1
 15,970 19,166
E-6
Al-RIE
 11,912 14,294
E-17
Chemical Dry Etcher (CDE)
 5,976 7,172
E-7
ULVAC ashing equipment
 4,066 4,880
E-18
Plasma cleaner
 3,198 3,838
E-8
BRANSON ashing equipment
 3,316 3,980
E-19
Ulvac ICP-RIE#2
 15,684 18,820
E-10
ULVAC multi-purpose RIE equipment
 10,902 13,082        
E-11
KOH etching equipment
 3,100 3,722        

F.Bonding, polishing and packaging
F-1
Wafer bonding equipment
 5,946 7,134
F-9
EVG wafer bonder
 6,112 7,336
F-2
TOKYO SEIMITSU dicer
 9,656 11,588
F-10
EVG aligner for wafer bonding
 5,302 6,362
F-3
DISCO dicer
 2,646 3,176
F-11
UV imprint
 6,638 7,964
F-4
Wire bonder
 1,186 1,424
F-12
Thermal imprint
 5,900 7,080
F-5
Laser marker
 2,436 2,922
F-13
Excimer lamp cleaner
 2,700 3,240
F-6
6-inch wafer polishing equipment
 2,120 2,544
F-14
Surface planer
 14,974 17,968
F-7
4-inch wafer polishing equipment
 1,822 2,186
F-15
Shibuya LAMICS AQL-1900
 8,018 9,622
F-8
Sand blast
 3,418 4,102

G.Measurement
G-1
Wafer dust detector
 1,976 2,372
G-15
Ultrasonic microscope
 2,284 2,742
Ｇ-2
Film thickness gage
 1,384 1,662
G-16
Digital thermo microscope
 1,248 1,496
G-3
Dektak step profiler
 1,658 1,990
G-17
Infrared microscope
 1,236 1,482
G-4
Tenchor step profiler
 1,658 1,990
G-18
Quadrupole mass analyzer
 1,226 1,472
G-5
Depth measuring equipment
 1,074 1,290
G-20
Quick coater
 1,338 1,606
G-6
4-probe measuring equipment
 1,076 1,290
G-22
Desktop Ellipsometer
 746 896
G-7
Spreading resistance profiler
 2,616 3,140
G-24
Laser/white light conforcal microscope
 4,728 5,674
G-8
Wafer prober
 2,666 3,198
G-25
Line-focus-beam acoustic microscope for material characterization #1
 3,488 4,184
G-9
Metal microscope
 1,152 1,382
G-26
Line-focus-beam acoustic microscope for material characterization #2
 3,488 4,184
G-10
Digital microscope
 1,540 1,848
G-27
FIB
 9,596 11,516
G-11
Thermal electron SEM
 2,632 3,158
G-28
XRD
 5,154 6,184
G-12
FE-SEM
4,622 5,546
G-29
 JEOL FE-SEM 5,330 6,396
G-13
Micro X-ray CT
 3,324 3,988        
G-14
Ellipsometer
 972 1,166        
※Nanofabrication：All charges listed here are including tax.