{"id":642,"date":"2021-11-14T22:07:57","date_gmt":"2021-11-14T13:07:57","guid":{"rendered":"https:\/\/aem-www.imr.tohoku.ac.jp\/dev\/cints\/?page_id=642"},"modified":"2021-11-23T10:22:23","modified_gmt":"2021-11-23T01:22:23","slug":"price","status":"publish","type":"page","link":"https:\/\/www.cints.tohoku.ac.jp\/en\/price\/","title":{"rendered":"Equipment\uff06Charges"},"content":{"rendered":"\n
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\u25a0Microstructural Characterization<\/a>
\u25a0Nanofabrication<\/a>(MEMS) <\/p>\n<\/div><\/div>\n<\/div>\n<\/div>\n\n\n\n

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Microstructural Characterization (Institute for Materials Research\/The Electron Microscopy Center)<\/th><\/tr><\/thead>
\u25a0Technical support charge: <\/strong>3,300 yen\/hour
\u25a0Sample preparation room<\/strong>\uff1a330yen\/hour<\/td><\/tr>
Equipment usage Charges\u3010yen\/day(8hours)\u3011<\/td><\/tr><\/tbody><\/table><\/figure>\n<\/div><\/div>\n<\/div>\n<\/div>\n\n\n\n\n\n\n\t\n\n\t\n\t\n\t\n\t
Equipment name<\/th>Open Project<\/th>Classified Project<\/th>\n<\/tr>\n<\/thead>\n
SU8000,S-5500<\/td>14,080<\/td>72,160<\/td>\n<\/tr>\n
Titan80-300<\/td>36,080 <\/td>106,480 <\/td>\n<\/tr>\n
FEI-Titan G2-cubed<\/td>46,640<\/td>121,440<\/td>\n<\/tr>\n
FEI-Titan G2-cubed<\/td>50,160<\/td>125,860<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
\u203bAll charges listed here are including tax.<\/h5>\n\n\n\n
Microstructural Characterization (Analytical Research Core for Advanced Materials)<\/th><\/tr><\/thead>
\u25a0Technical support charge:<\/strong>
Open project:3,300 yen\/hour
Classified Project:6,600yen\/hour<\/td><\/tr>
Equipment usage Charges\u3010yen\/day(8hours)\u3011<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n\n\n\n\t\n\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t
Equipment name<\/th>Open Project<\/th>Classified Project<\/th>\n<\/tr>\n<\/thead>\n
JEM-ARM200F<\/td>30,800<\/td>163,680<\/td>\n<\/tr>\n
Topcon EM-002B<\/td>25,520<\/td>51,920<\/td>\n<\/tr>\n
JEOL JEM-2000EXII<\/td>16,720<\/td>34,320<\/td>\n<\/tr>\n
FIB-SEM(Quanta 3D)<\/td>30,360<\/td>62,920<\/td>\n<\/tr>\n
FIB-SEM(Versa 3D)<\/td>30,360<\/td>62,920<\/td>\n<\/tr>\n
JEOL EM-09100IS<\/td>17,600<\/td>32,560<\/td>\n<\/tr>\n
PIPSII<\/td>9,680<\/td>22,880<\/td>\n<\/tr>\n
Model1010<\/td>3,520<\/td>13,200<\/td>\n<\/tr>\n
X-ray Diffractometer<\/td>6,160<\/td>32,560<\/td>\n<\/tr>\n
Thermoanalysis<\/td>5,280<\/td>12,320<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
\u203b All charges listed here are including tax.<\/h5>\n\n\n\n
Microstructural Characterization (Research and Analytical<\/strong> Center for<\/strong> Giant Molecules)<\/th><\/tr><\/thead>
Equipment usage Charges\u3010yen\/day(8hours)\u3011<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n\n\n\n\t\n\n\t\n\t
Equipment name<\/th>Open Project<\/th>Classified Project<\/th>\n<\/tr>\n<\/thead>\n
Nuclear magnetic resonance (NMR)<\/td>5,200<\/td>32,100<\/td>\n<\/tr>\n
ICP optical emission spectrometer<\/td>3,200<\/td>4,600<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
\u30fbRaw chemicals for syntheses are not included.
\u30fbAll charges listed here are including tax.<\/h5>\n\n\n\n
Nanofabrication(MEMS)<\/th><\/tr><\/thead>
\u3010Open Project\u3011
\u25a0Technical support fee: 3,300 yen\/hour\u3000\u3000
\u25a0Facility usage charge: 960 yen\/hour\uff08790 yen\/hour for the use within the Universityr \uff09

\u3010Classified Project\u3011
\u25a0Technical support fee: 6,514 yen\/hour\u3000\u3000
\u25a0Facility usage charge: 960 yen\/hour\uff08790 yen\/hour for the use within the Universityr \uff09<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n\n\n\n\t\n\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t\n\t
No.<\/th>Equipment name<\/th>Open P<\/th>Classified P<\/th>No.<\/th>Equipment name<\/th>Open P<\/th>Classified P
\n <\/th>\n<\/tr>\n<\/thead>\n
A.Cleaning & drying<\/td>\n<\/tr>\n
A-1<\/td>Draft chamber<\/td>1,290 <\/td>1,548 <\/td>A-7<\/td>Spin-drying machine<\/td>2,428 <\/td>2,914 <\/td>\n<\/tr>\n
A-2<\/td>Draft chamber for SiN etching<\/td>1,730 <\/td>2,076 <\/td>A-8<\/td>Organic draft chamber<\/td>1,290 <\/td>1,548 <\/td>\n<\/tr>\n
A-4<\/td>Inert oven for sintering<\/td>1,710 <\/td>2,052 <\/td>A-9<\/td>4\" spin drying machine<\/td>2,612 <\/td>3,134 <\/td>\n<\/tr>\n
A-5<\/td>Vacuum oven<\/td>994 <\/td>1,192 <\/td>A-10<\/td>6\"spin drying machine<\/td>2,612 <\/td>3,134 <\/td>\n<\/tr>\n
A-6<\/td>Brush scrubber<\/td>6,906 <\/td>8,286 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
B.Photolithography<\/td>\n<\/tr>\n
B-2<\/td>Spin coater<\/td>2,170 <\/td>2,604 <\/td>B-13<\/td>Elionix EB lithography<\/td>9,422 <\/td>11,306 <\/td>\n<\/tr>\n
B-3<\/td>Clean oven<\/td>2,830 <\/td>3,396 <\/td>B-14<\/td>Laser writer<\/td>7,094 <\/td>8,512 <\/td>\n<\/tr>\n
B-4<\/td>Curing oven<\/td>1,872 <\/td>2,246 <\/td>B-15<\/td>Maskless exposure system for ball<\/td>4,450 <\/td>5,340 <\/td>\n<\/tr>\n
B-5<\/td>Double-side aligner<\/td>3,240 <\/td>3,888 <\/td>B-16<\/td>Spin dryer<\/td>2,208 <\/td>2,650 <\/td>\n<\/tr>\n
B-8<\/td>Draft chamber for development<\/td>1,290 <\/td>1,548 <\/td>B-17<\/td>Hot plate<\/td>994 <\/td>1,192 <\/td>\n<\/tr>\n
B-9<\/td>UV curing<\/td>4,120 <\/td>4,944 <\/td>B-18<\/td>maskless aligner<\/td>5,374 <\/td>6,450 <\/td>\n<\/tr>\n
B-10<\/td>Spin coater<\/td>2,332 <\/td>2,798 <\/td>B-19<\/td>i-line stepper<\/td>14,960 <\/td>29,700 <\/td>\n<\/tr>\n
B-11<\/td>Spray developer<\/td>2,156 <\/td>2,588 <\/td>B-20<\/td>Coater developer<\/td>6,458 <\/td>13,200 <\/td>\n<\/tr>\n
C.Oxidation\/diffusion, ion injection and heat treatment<\/td>\n<\/tr>\n
C-1<\/td>Oxidation furnace (for semiconductors)\uff09 <\/td>10,598 <\/td>12,716 <\/td>C-7<\/td>Annealing furnace<\/td>10,112 <\/td>12,134 <\/td>\n<\/tr>\n
C-2<\/td>Oxidation furnace (for MEMS)<\/td>9,168 <\/td>11,000 <\/td>C-8<\/td>Medium-current ion injector<\/td>19,934 <\/td>23,922 <\/td>\n<\/tr>\n
C-3<\/td>P diffusion furnace<\/td>11,562 <\/td>13,874 <\/td>C-10<\/td>Rapid thermal annealing<\/td>8,522 <\/td>10,226 <\/td>\n<\/tr>\n
C-4<\/td>P push-in furnace<\/td>9,854 <\/td>11,824 <\/td>C-11<\/td>Metal diffusion furnace<\/td>7,856 <\/td>9,426 <\/td>\n<\/tr>\n
C-5<\/td>B diffusion furnace<\/td>10,938 <\/td>13,126 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
C-6<\/td>B push-in furnace<\/td>9,854 <\/td>11,824 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
D.Deposition<\/td>\n<\/tr>\n
D-1<\/td>LPCVD\uff08SiN\uff09 <\/td>12,108 <\/td>14,530 <\/td>D-12<\/td>MOCVD<\/td>19,484 <\/td>23,382 <\/td>\n<\/tr>\n
D-2<\/td>LPCVD\uff08Poly-Si\uff09<\/td>11,838 <\/td>14,206 <\/td>D-13<\/td>JPEL PECVD<\/td>15,156 <\/td>18,188 <\/td>\n<\/tr>\n
D-3<\/td>LPCVD\uff08SiO2\uff09 <\/td>12,808 <\/td>15,368 <\/td>D-14<\/td>TEOS PECVD<\/td>16,904 <\/td>20,286 <\/td>\n<\/tr>\n
D-4<\/td>CVD <\/td>21,326 <\/td>25,590 <\/td>D-15<\/td>Automatic Shibaura
\n sputtering<\/td>		6,524 <\/td>7,828 <\/td>\n<\/tr>\n
D-5<\/td>SUMITOMOSEIMITU PECVD <\/td>15,350 <\/td>18,420 <\/td>D-16<\/td>Sputtering for ball<\/td>4,392 <\/td>5,270 <\/td>\n<\/tr>\n
D-6<\/td>W-CVD <\/td>9,818 <\/td>11,782 <\/td>D-17<\/td>ALD<\/td>10,418 <\/td>12,502 <\/td>\n<\/tr>\n
D-7<\/td>ANELVA sputtering equipment<\/td>8,588 <\/td>10,306 <\/td>D-18<\/td>High-temp. sputtering and O2 annealing<\/td>11,698 <\/td>14,038 <\/td>\n<\/tr>\n
D-8<\/td>SHIBAURA sputtering equipment<\/td>3,758 <\/td>4,510 <\/td>D-20<\/td>ECR long-throw sputter<\/td>6,450 <\/td>7,740 <\/td>\n<\/tr>\n
D-9<\/td>Electron beam evaporator<\/td>6,838 <\/td>8,206 <\/td>D-21<\/td>SPP Technologies TEOS PECVD<\/td>16,770 <\/td>21,507 <\/td>\n<\/tr>\n
D-10<\/td>Sol-gel auto-deposition system<\/td>8,066 <\/td>9,680 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
D-11<\/td>Plating equipment<\/td>2,534 <\/td>3,040 <\/td><\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
E.Etching<\/td>\n<\/tr>\n
E-1<\/td>DeepRIE #1<\/td>8,054 <\/td>9,666 <\/td>E-12<\/td>TMAH etching equipment<\/td>3,112 <\/td>3,734 <\/td>\n<\/tr>\n
E-2<\/td>DeepRIE #2 <\/td>8,054 <\/td>9,666 <\/td>E-13<\/td>DeepRIE #4<\/td>14,770 <\/td>17,724 <\/td>\n<\/tr>\n
E-3<\/td>DeepRIE #3 <\/td>8,278 <\/td>9,934 <\/td>E-14<\/td>Ion milling<\/td>11,360 <\/td>13,632 <\/td>\n<\/tr>\n
E-4<\/td>ANELVA RIE equipment <\/td>7,078 <\/td>8,494 <\/td>E-15<\/td>Vapor HF etching<\/td>8,534 <\/td>10,240 <\/td>\n<\/tr>\n
E-5<\/td>ANELVA Si RIE equipment<\/td>6,346 <\/td>7,616 <\/td>E-16<\/td>Ulvac ICP-RIE#1<\/td>15,970 <\/td>19,166 <\/td>\n<\/tr>\n
E-6<\/td>Al-RIE<\/td>11,912 <\/td>14,294 <\/td>E-17<\/td>Chemical Dry Etcher (CDE)<\/td>5,976 <\/td>7,172 <\/td>\n<\/tr>\n
E-7<\/td>ULVAC ashing equipment<\/td>4,066 <\/td>4,880 <\/td>E-18<\/td>Plasma cleaner<\/td>3,198 <\/td>3,838 <\/td>\n<\/tr>\n
E-8<\/td>BRANSON ashing equipment<\/td>3,316 <\/td>3,980 <\/td>E-19<\/td>Ulvac ICP-RIE#2<\/td>15,684 <\/td>18,820 <\/td>\n<\/tr>\n
E-10<\/td>ULVAC multi-purpose RIE equipment<\/td>10,902 <\/td>13,082 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
E-11<\/td>KOH etching equipment<\/td>3,100 <\/td>3,722 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
F.Bonding, polishing and packaging<\/td>\n<\/tr>\n
F-1<\/td>Wafer bonding equipment<\/td>5,946 <\/td>7,134 <\/td>F-9<\/td>EVG wafer bonder<\/td>6,112 <\/td>7,336 <\/td>\n<\/tr>\n
F-2<\/td>TOKYO SEIMITSU dicer<\/td>9,656 <\/td>11,588 <\/td>F-10<\/td>EVG aligner for wafer bonding<\/td>5,302 <\/td>6,362 <\/td>\n<\/tr>\n
F-3<\/td>DISCO dicer<\/td>2,646 <\/td>3,176 <\/td>F-11<\/td>UV imprint<\/td>6,638 <\/td>7,964 <\/td>\n<\/tr>\n
F-4<\/td>Wire bonder<\/td>1,186 <\/td>1,424 <\/td>F-12<\/td>Thermal imprint<\/td>5,900 <\/td>7,080 <\/td>\n<\/tr>\n
F-5<\/td>Laser marker<\/td>2,436 <\/td>2,922 <\/td>F-13<\/td>Excimer lamp cleaner<\/td>2,700 <\/td>3,240 <\/td>\n<\/tr>\n
F-6<\/td>6-inch wafer polishing equipment<\/td>2,120 <\/td>2,544 <\/td>F-14<\/td>Surface planer<\/td>14,974 <\/td>17,968 <\/td>\n<\/tr>\n
F-7<\/td>4-inch wafer polishing equipment<\/td>1,822 <\/td>2,186 <\/td>F-15<\/td>Shibuya LAMICS AQL-1900<\/td>8,018 <\/td>9,622 <\/td>\n<\/tr>\n
F-8<\/td>Sand blast<\/td>3,418 <\/td>4,102 <\/td><\/td>\n<\/tr>\n
G.Measurement<\/td>\n<\/tr>\n
G-1<\/td>Wafer dust detector<\/td>1,976 <\/td>2,372 <\/td>G-15<\/td>Ultrasonic microscope<\/td>2,284 <\/td>2,742 <\/td>\n<\/tr>\n
\uff27-2<\/td>Film thickness gage<\/td>1,384 <\/td>1,662 <\/td>G-16<\/td>Digital thermo microscope<\/td>1,248 <\/td>1,496 <\/td>\n<\/tr>\n
G-3<\/td>Dektak step profiler<\/td>1,658 <\/td>1,990 <\/td>G-17<\/td>Infrared microscope<\/td>1,236 <\/td>1,482 <\/td>\n<\/tr>\n
G-4<\/td>Tenchor step profiler<\/td>1,658 <\/td>1,990 <\/td>G-18<\/td>Quadrupole mass analyzer<\/td>1,226 <\/td>1,472 <\/td>\n<\/tr>\n
G-5<\/td>Depth measuring equipment<\/td>1,074 <\/td>1,290 <\/td>G-20<\/td>Quick coater<\/td>1,338 <\/td>1,606 <\/td>\n<\/tr>\n
G-6<\/td>4-probe measuring equipment<\/td>1,076 <\/td>1,290 <\/td>G-22<\/td>Desktop Ellipsometer<\/td>746 <\/td>896 <\/td>\n<\/tr>\n
G-7<\/td>Spreading resistance profiler<\/td>2,616 <\/td>3,140 <\/td>G-24<\/td>Laser\/white light conforcal microscope<\/td>4,728 <\/td>5,674 <\/td>\n<\/tr>\n
G-8<\/td>Wafer prober<\/td>2,666 <\/td>3,198 <\/td>G-25<\/td>Line-focus-beam acoustic microscope for material characterization #1<\/td>3,488 <\/td>4,184 <\/td>\n<\/tr>\n
G-9<\/td>Metal microscope<\/td>1,152 <\/td>1,382 <\/td>G-26<\/td>Line-focus-beam acoustic microscope for material characterization #2<\/td>3,488 <\/td>4,184 <\/td>\n<\/tr>\n
G-10<\/td>Digital microscope<\/td>1,540 <\/td>1,848 <\/td>G-27<\/td>FIB<\/td>9,596 <\/td>11,516 <\/td>\n<\/tr>\n
G-11<\/td>Thermal electron SEM<\/td>2,632 <\/td>3,158 <\/td>G-28<\/td>XRD<\/td>5,154 <\/td>6,184 <\/td>\n<\/tr>\n
G-12<\/td>FE-SEM <\/td>4,622 <\/td>5,546 <\/td>G-29<\/td>JEOL FE-SEM<\/td>5,330 <\/td>6,396 <\/td>\n<\/tr>\n
G-13<\/td>Micro X-ray CT<\/td>3,324 <\/td>3,988 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n
G-14<\/td>Ellipsometer<\/td>972 <\/td>1,166 <\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\u00a0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n
\u203bNanofabrication\uff1aAll charges listed here are including tax.<\/h5>\n\n\n\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

\u25a0Microstructural Characterization\u25a0Nanofabrication(MEMS) Microstructural Characterization (Institute for Materials Research\/The Electron Microscopy Center) \u25a0Technical support charge: 3,300 yen\/hour\u25a0Sample preparation room\uff1a330yen\/hour Equipment usage Charges\u3010yen\/day(8hours)\u3011 \u203bAll charges listed here are including tax. Microstructural Characterization (Analytical Research Core for Advanced Materials) \u25a0Technical support charge:Open project:3,300 yen\/hourClassified Project:6,600yen\/hour Equipment usage Charges\u3010yen\/day(8hours)\u3011 \u203b All charges listed here are including tax. Microstructural Characterization (Research … Equipment\uff06Charges<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_lmt_disableupdate":"no","_lmt_disable":"","_locale":"en_US","_original_post":"https:\/\/www5.local\/?page_id=17","footnotes":""},"class_list":["post-642","page","type-page","status-publish","hentry","en-US"],"jetpack_shortlink":"https:\/\/wp.me\/Pdwa86-am","jetpack_sharing_enabled":true,"_links":{"self":[{"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/pages\/642","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/comments?post=642"}],"version-history":[{"count":8,"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/pages\/642\/revisions"}],"predecessor-version":[{"id":721,"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/pages\/642\/revisions\/721"}],"wp:attachment":[{"href":"https:\/\/www.cints.tohoku.ac.jp\/wp-json\/wp\/v2\/media?parent=642"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}